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DATA SHEET
MOS INTEGRATED CIRCUIT
PD16856
MONOLITHIC CD-ROM 3-PHASE SPINDLE MOTOR DRIVER
The PD16856 is a CD-ROM 3-phase spindle motor driver consisting of a CMOS controller and MOS bridge outputs. By employing 3-phase full-wave PWM as the drive method and MOS FETs at the output stage, it has been possible to reduce the power consumption of the PD16856 ever further than the conventional linear drive drivers that use bipolar transistors. By using a 30-pin shrink SOP package, a more compact-size has been achieved.
FEATURES
* * * * * * * * * * * * * Supply voltage for controller block: 5 V, supply voltage for output block: 12 V 3 V input available for the input interface Low on-state resistance (total on-state resistance of upper and lower MOS FETs) RON = 1.3 (TYP.) Low power consumption due to 3-phase full-wave PWM drive method On-chip hole bias switch (linked with STB pin) On-chip IND (FG) pulse switching function, 1-phase output or 3-phase composite output START/STOP pin included, acting as a brake during STOP Standby pins included, turning off internal circuit in standby Low current consumption: IDD = 3 mA (Max.), IDD (ST) = 1 A (Max.) On-chip thermal shutdown circuit On-chip current limiting circuit; reference voltage can be set externally On-chip low voltage malfunction prevention circuit On-chip reverse rotation prevention circuit 30-pin plastic shrink SOP (300 mil)
ORDERING INFORMATION
Part Number Package 30-pin shrink SOP (0.8-mm pitch, 300 mil)
PD16856GS
The information in this document is subject to change without notice.
Document No. S13447EJ1V0DS00 (1st edition) Date Published April 1999 N CP(K) Printed in Japan
(c)
1999
PD16856
ABSOLUTE MAXIMUM RATINGS (TA = 25C)
Parameter Supply voltage Symbol VDD VM Input voltage Instantaneous output current Power consumption
Note 2 Note 1
Conditions
Ratings -0.5 to +6.0 -0.5 to +13.5 -0.5 to VDD + 0.5
Unit V V V A/phase W C C
VIN IDR (pulse) PT TCH (MAX) Tstg PW 5 ms, Duty 30%
2.0 1.0 150 -55 to +150
Peak channel temperature Storage temperature range
Notes 1. Allowable current per phase while on-board 2. When mounted on glass epoxy board (100 mm x 100 mm x 1 mm)
RECOMMENDED OPERATING RANGE
Parameter Supply voltage Symbol VDD VM Output current (DC) Instantaneous output current Hole bias current IND pin output current CL pin input voltage Operating temperature range IDR (DC) IDR (pulse) IHB IFG VCL TA 0 0.1 -20 PW 5 ms, Duty 10% 10 2.5 Conditions MIN. 4.5 10.8 TYP. 5.0 12.0 MAX. 5.5 13.2 0.5 1.5 15 5 0.4 75 Unit V V A/Phase A/Phase mA mA V C
2
Data Sheet S13447EJ1V0DS00
PD16856
ELECTRICAL SPECIFICATIONS (UNLESS OTHERWISE SPECIFIED, TA = 25C, VDD = 5 V, VM = 12 V)
Parameter [General] Current consumption 1 (during operation) Current consumption (in standby) [ST/SP, STB, REV, FGsel] Input voltage, high Input voltage, low Input pull-down resistor [Controller block] Triangle wave oscillation frequency [Hole amplifier] Common mode input voltage range Hysteresis voltage Input bias current [Hole bias block] Hole bias voltage [FG output] IND-pin voltage, high IND-pin voltage, low [Output block] Output on-state resistance (upper stage + lower stage) Leakage current during OFF Output turn-on time Output turn-off time [Torque command] Control reference input voltage range Control input voltage range Input current Input voltage difference Dead zone (+) Dead zone (-) [Overcurrent detection block] Input offset voltage VIO -15 +15 mV ECR EC IIN ECR-EC EC_d+ EC_d-
Note
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
IDD IDD
(ST)
STB = VDD STB = GND
1.5
3.0 1.0
mA
A
VIH VIL RIND
1.8
VDD 0.8 120
V V k
fPWM
CT = 100 pF
75
kHz
VHch VHhys IHbias VH = 2.5 V
1.0 15
3.5
V mV
1.0
A
VHB
IHB = 10 mA
0.3
0.5
V
VFG_H VFG_L
IFG = -2.5 mA IFG = +2.5 mA
4.0 0.5
V V
RON IDR (OFF) tONH tOFFH
IDR = 200 mA TA = -20C to +75C In standby RM = 5 Star connection
1.3
1.8 10
A s s
1.0 1.0
2.0 2.0
0.3 0.3 30 DUTY = 100% 1.5 V ECR 2.5 V 1.5 V ECR 2.5 V 0 0 1.0 50 -50
4.0 4.0 50
V V
A
V
100 -100
mV mV
Note Dead zone not included. Remarks 1. The thermal shutdown circuit (T.S.D.) operates with TCH > 150C. 2. The low-voltage malfunction prevention circuit (UVLO) operates with a voltage of 4 VTYP.
Data Sheet S13447EJ1V0DS00
3
PD16856
PIN FUNCTIONS
Package: 30-pin Shrink SOP (300 mil)
IND STB VM VM OUT2 RF RF OUT1 VM VM OUT0 RF RF ISEN CL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 EC ECR VDD CT H2+ H2- H1+ H1- H0+ H0- HB FGsel ST/SP REV GND
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 IND STB VM VM
Pin Name Index signal output pin
Pin Function Standby operation input pin Supply input pin for motor block (12 V) Supply input pin for motor block (12 V) Motor connection pin 3-phase bridge common pin 3-phase bridge common pin Motor connection pin Supply input pin for motor block (12 V) Supply input pin for motor block (12 V) Motor connection pin 3-phase bridge common pin 3-phase bridge common pin Sense resistor connection pin Overcurrent detection voltage input pin GND pin Reverse rotation input pin (reverse brake pin) Start/stop input pin IND pulse selection pin Hole bias pin Hole signal input pin Hole signal input pin Hole signal input pin Hole signal input pin Hole signal input pin Hole signal input pin Oscillation frequency setup capacitor connection pin Controller block supply input pin (5 V) Control reference voltage input pin Control voltage input pin
OUT2 RF RF OUT1 VM VM OUT0 RF RF ISEN CL GND REV ST/SP FGsel HB H0- H0+ H1- H1+ H2- H2+ CT VDD ECR EC
Caution
When there is more than one pin of the same kind of pin (VM and RF), all pins should be connected to their targets.
4
Data Sheet S13447EJ1V0DS00
PD16856
BLOCK DIAGRAM
IND 1
30 EC
STB 2
29 ECR
VM 3 UVLO OSC VM 4 Q5 OUT2 5 Q6 RF 6 Phase excitation pulse generator Q3 OUT1 8 Q4 VM 9 + - Q1 OUT0 11 Q2 RF 12 Ganged with STB - - T.S.D +
28 VDD
27 CT
26 H2+
25 H2-
RF 7
+
24 H1+
23 H1-
22 H0+
VM 10
21 H0-
20 HB
19 FGsel
RF 13 Reverse rotation detection circuit
18 ST/SP
ISEN 14
17 REV
CL 15
16 GND
Caution
When there is more than one pin of the same kind of pin (VM and RF), all pins should be connected to their targets.
Data Sheet S13447EJ1V0DS00
5
PD16856
TOTAL POWER DISSIPATION VS. AMBIENT TEMPERATURE CHARACTERISTICS
PT vs. TA Characteristics 1.4 While mounted on a 100 mm x 100 mm x 1.0 mm glass epoxy board 1.2
Total power dissipation PT (W)
25C 1.0 1.0 W
125C/W 0.8
0.6
0.4
0.2 75C 0 -20 0 25 50 75 100 125 150
Ambient temperature TA (C)
Remark
It is possible to apply a maximum of 1 W of power when the ambient temperature is 25C or lower. When the ambient temperature is higher than 25C, derate based on the above chart. It is possible to apply 0.6 W to the IC when the ambient temperature is 75C, which is within recommended ambient temperature conditions.
6
Data Sheet S13447EJ1V0DS00
PD16856
STANDARD CHARACTERISTICS CURVES (UNLESS OTHERWISE SPECIFIED, TA = 25C)
IDD and IDD (ST) vs. VDD Characteristics
Torque command block input current IIN (A)
IIN vs. VDD Characteristics (EC and ECR pins) 50 EC, ECR = 4 V 40
2.0
Circuit current IDD (mA) Circuit current in standby IDD (ST) (A)
30
IDD 1.0
20
IIN
10
0 4.5
IDD (ST) 5.0 Controller block supply voltage VDD (V) 5.5
0 4.5
5.0 Controller block supply voltage VDD (V)
5.5
VIH and VIL vs. VDD Characteristics (ST/SP, REV, STB, and FGsel pins) 2.0
Hole amplifier hysteresis voltage VHhys (mV)
VHhys vs. VDD Characteristics (Hole Amplifier Input) 20 VH = 2.5 V
Input voltage, high VIH (V) Input voltage, low VIL (V)
1.5 VIH VIL
15
VHhys
1.0 4.5
5.0 Controller block supply voltage VDD (V)
5.5
10 4.5
5.0 Controller block supply voltage VDD (V)
5.5
fPWM vs. VDD Characteristics 100 CT = 100 pF
PWM oscillation frequency fPWM (kHz) Output on-state resistance RON ()
RON vs. TA Characteristics 1.5 VDD = 5 V
fPWM
RON
50
1.0
VIL
0 4.5
5.0 Controller block supply voltage VDD (V)
5.5
0.5
30
40
50
60
70
Operating ambient temperature TA (V)
Data Sheet S13447EJ1V0DS00
7
PD16856
FUNCTION OPERATION TABLE (1) ST/SP = "H"
Input Signal CMP0 H H H H H H L L L L L L CMP1 H H L L L L L L H H H H CMP2 L L L L H H H H H H L L PWM H L H L H L H L H L H L Operation Brake Operation Brake Operation Brake Operation Brake Operation Brake Operation Brake UV UW VW VU WU WV Circuit Operation Mode Source Sink
Brake: Regenerates via the high-side Pch MOS FET channel. (2) ST/SP = "L"
Input Signal CMP0 - CMP1 - CMP2 - PWM - Short brake Circuit Operation Mode
Short brake: Turns the high-side MOS FET on and the low-side MOS FET off. (3) Torque Command The curve shown below is the relationship to torque of the difference (ECR - EC) between the control reference voltage (ECR) and the control voltage (EC).
Duty cycle Normal direction torque 100%
(-)
ECR-EC
(+)
-100% Reverse direction torque
Reverse Rotation Pin Voltage (REV) L ECR > EC ECR < EC Normal rotation Reverse rotation
Note
H Reverse rotation Stop
Note
Note Stops after detecting reverse rotation The reverse drive current flows in the high-side Pch MOS FET channel on reverse rotation.
8
Data Sheet S13447EJ1V0DS00
PD16856
(4) Standby Mode The setting of the standby mode allows the power supply in the device to be turned off forcibly. The status of outputs from pins in standby is high impedance (H-bridge all OFF). In addition it is possible to reduce the circuit current since the internal oscillation block stops. When the stop operation is executed by the standby pin during normal operation, the motor is stopped by inertia force. When the normal status is reset, it takes several tens of s to be activated.
STB Pin H L Operation Mode Normal operation mode Standby mode
Data Sheet S13447EJ1V0DS00
9
PD16856
TIMING CHART
(1) Hole Signal Input
H0
H1
H2
(2) CMP Signal (FGsel = L: IND1, FGsel = H: IND2)
CMP0
CMP1
CMP2
IND1
IND2
(3) Selection of Output MOS FET Drive and Comparator (A Blank Indicates Switch OFF)
Q1 Q2 Q3 Q4 Q5 Q6 SW SW ON
SW SW
SW SW ON ON SW SW
ON
ON SW SW SW SW ON
SW SW
SW SW ON ON SW SW
ON
ON SW SW SW SW ON
ON
SW SW
ON
SW SW
10
Data Sheet S13447EJ1V0DS00
PD16856
(4) Motor Drive Waveform
OUT0
PWM
PWM
OUT1
PWM
PWM
PWM
OUT2
PWM
PWM
Data Sheet S13447EJ1V0DS00
11
12
5V + 15 F controller CPU VM 3 UVLO OSC 27 CT T.S.D + - 26 H2+ 25 H2- 24 H1+ + - 23 H1- + - Q1 OUT0 11 Q2 RF 12 RF 13 RFIL 1.8 k ISEN 14 RS 0.3 CFIL CL 15 VCL 0.3 V 330 pF Reverse rotation detection circuit Ganged with STB 20 HB 19 FGsel 18 ST/SP 17 REV 16 GND CPU CPU CPU 22 H0+ 21 H0- 200 HU HV HW 100 pF 28 VDD STB 2 29 ECR IND 1 30 EC controller controller + 200 Motor W phase VM 4 Q5 OUT2 5 Q6 RF 6 RF 7 Q3 Motor V phase OUT1 8 Q4 VM 9 VM 10 Motor U phase Phase excitation pulse generator
Remark
12 V
APPLICATION CIRCUIT EXAMPLE
(47 F in the above figure).
Moreover, set VCL and RS to values within the ratings.
47 F
To eliminate noise during PWM, it is recommended to insert a tantalum capacitor between VM and GND
This circuit is for reference only and is not intended for use in mass production.
Data Sheet S13447EJ1V0DS00
PD16856
PD16856
PACKAGE DRAWING
30-Pin Plastic Shrink SOP (300 mil) (Unit: mm)
30 16 Detail of lead end
1
13.0 MAX.
15
1.550.1
7.70.3 5.60.2 1.050.2
1.8 MAX.
0.10.1
0.8 0.35-0.05
+0.10
0.10 0.10 M
0.9 MAX.
0.20 -0.05
+0.10
0.60.2
3 +7 -3
Data Sheet S13447EJ1V0DS00
13
PD16856
RECOMMENDED SOLDERING CONDITIONS
PD16856 should be soldered and mounted under the following recommended conditions. For soldering methods
and conditions other than those recommended below, contact your NEC sales representative. * For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E).
Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235C, Time: 30 sec. Max. (at 210C or higher), Count: three times or less, Exposure limit: none , Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% Max.) is recommended VPS Package peak temperature: 215C, Time: 40 sec. Max. (at 200C or higher), Count: three times or less, Exposure limit: none , Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% Max.) is recommended Wave soldering Package peak temperature: 260C, Time: 10 sec. Max., Proheating temperature: 120C Max., Count: once, Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% Max.) is recommended WS60-00-1
Note Note
Recommended Condition Symbol IR35-00-3
VP15-00-3
Note After opening the dry pack, store it at 25C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together.
14
Data Sheet S13447EJ1V0DS00
PD16856
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
* * * * *
Device availability Ordering information Product release schedule Availability of related technical literature Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) Network requirements
*
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288
NEC Electronics (Germany) GmbH
Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580
NEC Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd. NEC Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
NEC Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490
NEC Electronics (France) S.A. NEC Electronics (UK) Ltd.
Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 Spain Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583
NEC Electronics Taiwan Ltd. NEC Electronics Italiana s.r.l.
Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99
NEC Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388
Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829
J99.1
Data Sheet S13447EJ1V0DS00
15
PD16856
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5

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